Product Description
TECHSPRAY 1978-DP - SILICONE-FREE HEAT SINK COMPOUND - SILICONE-FREE HEAT SINK COMPOUND SIZE 4 OZ. APPLICATION IN ELECTRONICS HEAT SINK COMPOUND IS USED TO THERMALLY BOND A COMPONENT AND A MECHANICAL HEAT SINK EFFICIENT COOLING - EQUAL TO 19YY66
MANUFACTURER:
TECHSPRAY
MANUFACTURER PART NUMBER:
1978-DP
UNIT OF MEASURE:
EA
QTY PER UNIT OF MEASURE:
1
COUNTRY OF ORIGIN:
UNITED STATES OF AMERICA
ORDER INCREMENT:
1
WEIGHT:
0.26
CONTRACTOR PART NUMBER:
2510688633
MAS CONTRACT NUMBER:
47QSEA20D0043